Even if a substrate having a semiconductor package mounted thereon is curved, the stress on an electric connection is released to eliminate a poor connection thereby to improve a connection reliability. A semiconductor chip (10) has an electrode (11) on its second face (10b). Semiconductor blocks (20) are arranged at two portions on the peripheral edge of a first face (10a) of the semiconductor chip (10), and can be bent and warped. An interposer (30) is arranged with respect to the semiconductor chip (10) through and across the support blocks (20), and has a wiring pattern in a flexible resin film. The interposer (30) is folded back at its two end portions to the side of the second face (10b) of the semiconductor chip (10), and has its wiring pattern connected electrically with the electrode (11) of the semiconductor chip (10).