A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providA process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7, 8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laing first and second laminates (7, 8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1), in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, andminate, securing the laminates in a stack (1), in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, andmaking a plurality of electrical connections (31, 51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC condu making a plurality of electrical connections (31, 51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.ctive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.