The invention provides an encapsulation structure, which comprises a cover plate, unit cavities, cutting ways, solder pad areas and clearance areas, wherein the unit cavities are positioned on the cover plate and discretely arranged; each unit cavity comprises a cavity and a unit cavity wall positioned on the periphery of the cavity; the cutting ways are positioned between adjacent unit cavities;the solder pad areas are positioned on edges of unit cavity walls and discretely arranged; the clearance areas are positioned in areas on the edges of the unit cavity walls excluding the solder pad areas; and corresponding edges of the unit cavity walls of the adjacent unit cavities are partially connected through the cutting ways. The corresponding edges of the unit cavity walls of the adjacent unit cavities are partially connected through the cutting ways on the cover plate, so the bonding force between the cavity walls and chips can be improved, and the problem that the mechanical stress generated in a subsequent V-shaped groove cutting process makes the cavity walls and the chips peel off to cause large-area yield loss is prevented.