The invention relates to a wafer-level vacuum encapsulation wire interconnecting structure of a micro electro mechanical system and a manufacturing method thereof, belonging to a wire interconnectingstructure of a micro electro mechanical system and a manufacturing method thereof. The invention solves the problems that the prior interconnecting structure has high alignment precision requirement and can not ensure the corrosion depth consistency, and improves the vacuum degree retentivity and realizes the electrical signal communication. In the interconnecting structure, a through hole is arranged on a silicon basal plate, an insulation layer is arranged on the surfaces of the through hole and the silicon basal plate, a metal electrode passes through the through hole and seals the throughoff, an intermediate layer is arranged between the metal electrode and the insulation layer, a cover plate is bonded with the silicon basal plate, and a space in the cover plate is a vacuum chamber used for placing an MEMS component. The method for manufacturing the wafer-level vacuum encapsulation wire interconnecting structure comprises the following steps: etching the through hole, making the insulation layer, the intermediate layer and the metal electrode, making a welding ring or forming an annular groove by corrosion, bonding, and the like. The invention has high sealing quality, long vacuum retention time, small bonding stress, good reliability and lower cost, and can greatly promote the commercial popularization of a wafer-level MEMS vacuum encapsulation technology.