This invention provides a film for machining wafer (10) which can effectively restrain the transfer print trace to the adhesives layer (12) by means of simple structure without increasing the material cost or manufacturing process. Cutting the labeling part (13a) of the film for machining wafer as followed form in advance: the operation is performed at least in the periphery transfer print section(13d) overlapped with said adhesives layer (12) when the film for machining wafer (10) being winded in the form of roller shape, therefore, the overall length of the periphery transfer print section(13d) is longer than that of the periphery transfer print section of arc length having a radius of r when the shortest distance from the center or the adhesives layer (12) to said periphery transfer print section(13d) is set as r.