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发明公开
CN101868125A 一种防止选化PCB板镍金层受腐蚀的方法 无效 - 驳回

一种防止选化PCB板镍金层受腐蚀的方法
摘要：
本发明公开了一种防止选化PCB板镍金层受腐蚀的方法，主要包括步骤A：制造选化PCB板；B：将选化PCB板浸泡在浓度为5％-15％、pH值为8.5～9.5的水相封孔剂溶液中1～2分钟，使选化PCB板镍金层上形成保护膜；C：对选化PCB板进行OSP处理。本发明在对选化PCB板进行OSP处理之前，将选化PCB板浸泡在水相封孔剂溶液中，使选化PCB板镍金层上形成一层保护膜，当需要对选化PCB板进行OSP处理时，微蚀药水则无法进入到镍金层中的原子孔隙中，从而避免了镍金层被微蚀药水腐蚀、黑化的问题。与现有技术相比，本发明从根本上解决了选化PCB板镍金层腐蚀、变色的问题，具有成本低、工艺简单的优点。
摘要（英）：

The invention discloses a method for preventing a processed PCB board nickel-gold layer from being eroded. The method mainly comprises the following steps that: A. a processed PCB board is manufactured, B. the processed PCB board is dipped in aqueous phase sealant solution with the concentration of 5 to 15 percent and the PH value of 8.5 to 9.5 for 1 to 2 minutes so that a protective film is formed on the processed PCB board nickel-gold layer, and C. OSP processing is carried out on the processed PCB board. Before the OSP processing of the processed PCB board, the processed PCB board is dipped in the aqueous phase sealant solution so that the protective film is formed on the processed PCB board nickel-gold layer. When the OSP processing needs to be carried out on the processed PCB board, microetching liquid medicine can not enter atom pores in the nickel-gold layer, consequently the nickel-gold layer can not be eroded and blackened by the microetching liquid medicine. Compared with the prior art, the invention solves the erosion and darkening problems of the processed PCB board nickel-gold layer thoroughly and has the advantages of low cost and simple technology.

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