The invention relates to method for producing a plurality of semiconductor chips (1). A plurality of semiconductor elements (2) is made available on a substrate (8), the semiconductor elements (2) being interspaced by gaps (25). A structured carrier (33) is made available and comprises a plurality of elevations (35). The structured carrier (33) is positioned relative to the substrate (8) in such a manner that the elevations of the structured carrier (33) extend into the gaps (25) between the semiconductor elements (2), thereby producing a mechanically stable composite (38) which comprises thesubstrate (8) and the structured carrier (33). The composite (38) is subdivided into a plurality of semiconductor chips (1). The invention further relates to a semiconductor chip.