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发明公开
CN102005399A 提供大键合力的旋转键合工具 有权

提供大键合力的旋转键合工具
摘要：
本发明公开了一种晶粒键合机，其包含有：键合头，其包含有负荷轴和夹体，该负荷轴穿过键合头，该夹体设置在该负荷轴的一端以用于固定待键合的晶粒；键合力马达，其用于沿着移动轴线在朝向和背离晶粒键合位置的方向上驱动负荷轴；旋转马达，其用于围绕平行于移动轴线的旋转轴线旋转负荷轴；耦合器，其用于将负荷轴耦接到键合力马达；其中，该耦合器还包含有轴承，该轴承被配置来使得负荷轴实现围绕旋转轴线相对于该键合力马达旋转。
摘要（英）：

A die bonder comprises a bond head having a load shaft which passes through the bond head and a collet located at one end of the load shaft for holding a die to be bonded. A bond force motor is operative to drive the load shaft along a travel axis in directions towards and away from a die bonding position. A rotary motor is operative to rotate the load shaft about a rotational axis parallel to the travel axis. A coupler which comprises a bearing couples the load shaft to the bond force motor to allow the load shaft to rotate about the rotational axis relative to the bond force motor.

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