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发明授权
CN102047397B 使用锡焊膏进行的基板与焊件的接合方法 失效 - 权利终止

使用锡焊膏进行的基板与焊件的接合方法
摘要：
在使用该锡焊膏进行的基板与焊件的接合方法中，在形成于上述基板上的金属化镀层与形成于上述焊件上的金属化镀层之间搭载或涂抹上述锡焊膏，然后在非氧化性气氛中进行回流焊处理，将上述基板与上述焊件接合。在上述基板的表面上形成的上述金属化镀层具有平面形状，该平面形状包含面积比上述焊件的上述金属化镀层面积小的金属化镀层本体部分和自上述金属化镀层本体部分的周围突出的锡焊引导部。
摘要（英）：

In this method of bonding a part to a substrate using a solder paste, the solder paste is mounted or applied between a metallization layer formed on the substrate and a metallization layer formed on the part, and the part is bonded to the substrate by performing a reflow process in a non-oxidizing atmosphere to bond the substrate and the part. The metallization layer formed on the surface of the substrate is planar and includes a metallization layer main portion that has an area smaller than that of the metallization layer of the part and a solder guide portion that protrudes from a periphery of the metallization layer main portion.

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