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发明公开
CN102150240A 用于加工半导体薄膜晶片的晶片支撑粘合膜 失效 - 权利终止

用于加工半导体薄膜晶片的晶片支撑粘合膜
摘要：
本发明提供了用于制造半导体薄膜晶片的晶片支撑粘合膜，所述半导体薄膜晶片在半导体晶片的膜减薄工艺期间不需要单独的粘合装置，所述晶片支撑粘合膜不受半导体晶片尺寸的任何限制，其通过在耐热基材上涂布丙烯酸类粘合剂层而防止研磨水渗透，其在剥离期间不在电路表面上留下任何粘合剂层且因此不需要附加的洗涤工艺，从而防止了在复杂的工艺期间可能发生的半导体晶片中的损伤以及电路表面的污染。为此，本发明的所述用于制造半导体薄膜晶片的晶片支撑粘合膜包含耐热基材和涂布在耐热基材上的耐热粘合剂层，其中所述耐热粘合剂层包含分子量为500,000～3,000,000的丙烯酸类共聚物、可能量束固化的丙烯酸类低聚物和光引发剂。
摘要（英）：

The present invention relates to an adhesive film for a wafer support for processing a wafer of a semiconductor thin film. More particularly, the present invention relates to an adhesive film for a wafer support for processing a wafer of a semiconductor thin film which eliminates the necessity of an attachment apparatus in a film-thinning process for a semiconductor wafer, can be used regardless of the semiconductor wafer size, prevents the ingress of grinding water by coating an acrylic adhesive layer onto a heat resistant base, and leaves no adhesive layer on a circuit surface during a delamination process and thus eliminates the necessity of an additional cleaning process, thereby preventing damage to the semiconductor wafer and the contamination of the circuit surface which might occur during a complicated process. To this end, the adhesive film for a wafer support for processing a wafer of a semiconductor thin film according to the present invention comprises a heat-resistant base and a heat-resistant adhesive layer coated on the heat-resistant base, wherein said heat-resistant adhesive layer comprises an acrylic copolymer having a molecular weight of 500,000 to 3,000,000, anenergy ray-curable acrylic oligomer, and a photoinitiator.

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