A method for producing a resin molded electronic component using a first molding die having a cavity that is open at the top and a second molding die to be combined with the first molding die on the upper side of the first molding die is comprised of the following steps. A) a step of inserting elements of electronic components and a liquid resin precursor having a viscosity of 10 paS or less at 40 DEG C into the cavity of the first molding die, B) a step of disposing the second molding die so as to sandwich the elements and the resin precursor after step (A), and C) a step of pressing the elements and the resin precursor between the first molding die and the second molding die so that the resin precursor is hardened by the temperature of the second molding die, after step (B). The temperature of the second molding die is set so as to be higher than the temperature of the first molding die.