Provided is a jet solder bath wherein the interval of a primary jet nozzle and a secondary jet nozzle can be adjusted easily. A jet solder bath (1) includes a solder bath body (2), a duct (6) for a secondary jet nozzle, a secondary jet nozzle (5), and a secondary jet nozzle tilting device (8) which tilts the secondary jet nozzle (5) toward the direction opposite from the conveyance direction of a printed board. The secondary jet nozzle tilting device (8) has two coupling members (8a) which are arranged, respectively, on two longitudinal walls (5d) of the secondary jet nozzle (5) and hooked, respectively, to two flanges (6a), and an installation height adjusting mechanism (11) which adjusts the installation height of the two coupling members (8a) individually with respect to the two longitudinal walls (5d). The installation height adjusting mechanism (11) has a fixing pin which penetrates both one of a plurality of through holes (8b) bored in the longitudinal walls (5d) of the two coupling members (8a) toward the horizontal direction, and one of a plurality of through holes (5e) bored in the two longitudinal walls (5d) of the secondary jet nozzle (5) toward the oblique upward direction.