The invention relates to a semiconductor device with connecting points nested in rows. The semiconductor device arranged on a moulded surface is provided with a group of electric contact elements in paired sawtooth rows, wherein the electric contact elements are close to opposite edges of an active face of the semiconductor device and are substantially extended in parallel with the opposite edges; each row of the pair rows comprises an inner sawtooth row of the electric contact elements, which is nested in an outer sawtooth row of the electric contact elements; and the electric contact elements of each inner sawtooth row and each outer sawtooth row are partially arrayed in the form of crossed fingers. When the device is manufactured, a used lead frame is also provided with a pipe core welding disc positioned in the group of paired sawtooth rows, and an outer frame element positioned outside the group of paired sawtooth rows; and the pipe core welding disc and the outer frame element respectively support the inner sawtooth rows and the outer sawtooth rows of the electric contact elements.