利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN102751225A 用于较薄管芯处理的方法和装置 无效 - 驳回 复审申请

用于较薄管芯处理的方法和装置
摘要：
一种用于处理较薄集成电路管芯的真空端部和方法。公开了用于附接集成电路管芯的真空端部，该真空端部包括：真空端部，用于附接到集成电路管芯，真空端部包括真空端口并且具有底面，真空端口被配置为连接至位于上表面上的真空源；以及至少一个真空孔，连接至真空端口，并且延伸穿过真空端部，并且在真空端部的底面处暴露至少一个真空孔；其中，真空端部的底面被配置为与集成电路管芯的表面物理接触。公开了用于处理集成电路管芯的方法。本发明还提供了一种用于较薄管芯处理的方法和装置。
摘要（英）：

A vacuum tip and methods for processing thin integrated circuit dies are disclosed. The vacuum tip for attaching to an integrated circuit die is disclosed comprising a vacuum port configured to connect to a vacuum supply on an upper surface and having a bottom surface; and at least one vacuum hole extending through the vacuum tip and exposed at the bottom surface of the vacuum tip; wherein the vacuum tip is configured to physically contact a surface of an integrated circuit die. Methods for processing integrated circuit dies are disclosed. The invention further provides a method and a device for processing thin dies.

0/0