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发明公开
CN103170617A 一种改性Ag膏及其应用以及功率模块中芯片和基体连接的烧结方法 有权 转让

一种改性Ag膏及其应用以及功率模块中芯片和基体连接的烧结方法
摘要：
本发明公开了一种改性Ag膏，其特征在于，该改性Ag膏含有金属粉和有机物，以改性Ag膏的总量为基准，金属粉为70-80重量％，有机物为20-30重量％，金属粉中含有Ag，并含有Sn、Sb、Cu、Ni和Zn中的至少一种，以金属粉的总量为基准，Ag为75-99.9重量％，Sn为0-12重量％，Sb为0-8重量％，Cu为0-5重量％，Ni为0-0.01重量％，Zn为0-0.01重量％，且Sn、Sb、Cu、Ni和Zn的总量为0.1-25重量％；有机物包括粘结剂，以有机物的总量为基准，粘结剂为15-100重量％。公开了上述改性Ag膏的应用及烧结方法。本发明的改性Ag膏提高了低温烧结中Ag膏与基体的结合力。
摘要（英）：

The invention discloses an improved silver paste which is characterized by including metal powder and organic matter. Based on the total amount of the improved silver paste, the improved silver paste comprises 70-80wt% of the metal powder and 20-30wt% of the organic matter. The metal powder includes silver and at least one type of stannum, antimony, copper, nickel and zinc. Based on the total amount of the metal powder, the metal powder comprises 75-99.9wt% of the silver, 0-12wt% of the stannum, 0-8wt% of the antimony, 0-5wt% of the copper, 0-0.01wt% of the nickel and 0-0.01wt% of the zinc. The total amount of the stannum, the antimony, the copper, the nickel and the zinc is 0.1-25wt% of the metal powder. The organic matter comprises binder. Based on the total amount of the organic matter, the organic matter comprises 15-100wt% of the binder. The invention further discloses application of the improved silver paste and a sintering method. The improved silver paste can improve binding force of the silver paste and a base body in the process of low-temperature sintering.

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