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发明授权
CN103367301B 集成电路器件中的细长凸块 有权

集成电路器件中的细长凸块
摘要：
本发明公开了集成电路器件中的细长凸块，其中一种器件包括衬底、位于衬底上方的金属焊盘、覆盖金属焊盘边缘部分的钝化层。钝化层具有与金属焊盘重叠的第一开口，第一开口具有在与衬底的主面平行的方向上测量的第一横向尺寸。聚合物层位于钝化层上方并覆盖金属焊盘的边缘部分。聚合物层具有与金属焊盘重叠的第二开口。第二开口具有在该方向上测量的第二横向尺寸。第一横向尺寸比第二横向尺寸大约7μm以上。凸块下金属化层(UBM)包括位于第二开口中的第一部分和覆盖部分聚合物层的第二部分。
摘要（英）：

A device includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. The passivation layer has a first opening overlapping the metal pad, wherein the first opening has a first lateral dimension measured in a direction parallel to a major surface of the substrate. A polymer layer is over the passivation layer and covering the edge portions of the metal pad. The polymer layer has a second opening overlapping the metal pad. The second opening has a second lateral dimension measured in the direction. The first lateral dimension is greater than the second lateral dimension by more than about 7 μm. A Under-Bump metallurgy (UBM) includes a first portion in the second opening, and a second portion overlying portions of the polymer layer.

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