Provided is a wiring board wherein collapse and peeling of connecting terminals during the manufacture steps are suppressed by ensuring bonding strength of the connecting terminals. A wiring board relating to the present invention is a wiring board having a laminated body wherein one or more insulating layers and one or more conductor layers are laminated therein. The wiring board is characterized in that: the wiring board is provided with a plurality of connecting terminals that are formed at intervals on the laminated body, and a filling member that is applied to between the connecting terminals, up to a position lower than the height of the connecting terminals; and the cross-section of the connecting terminals is a trapezoid having the width of a first main surface on the side in contact with the laminated body larger than the width of a second main surface facing the first main surface.