The invention relates to a packaging structure of a brushless direct-current motor integrated drive circuit. The packaging structure comprises a lead frame, a plurality of chips are spliced on a base island of the lead frame and are electrically connected with the lead frame, and the chips and the lead frame are packaged through packaging plastics and are cured. The invention further discloses a packaging method of the packaging structure of the brushless direct-current motor integrated drive circuit. The three IC chips and six field-effect transistors are packaged in the same circuit, the brushless direct-current motor integrated drive circuit is obtained, the application circuit design is greatly simplified, the integration of the application circuit is improved, the stability and reliability of the application circuit are improved, and the size of the drive circuit is reduced. Electrical parameter screening does not need to be carried out on a device, cost can be obviously lowered, and production efficiency is improved.