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发明公开
CN104054402A 用于制造电路板的方法(其涉及移除该电路板的子区域)和该方法的应用 无效 - 撤回

用于制造电路板的方法(其涉及移除该电路板的子区域)和该方法的应用
摘要：
本发明涉及用于制造电路板的方法，其涉及移除该电路板的子区域。在所述方法中，电路板(1)的至少两个层或层片相互连接，而通过提供防粘附或防粘结物料的层(7)，防止要移除的子区域(6)被连接到该电路板的相邻层片，然后把要移除的子区域(6)的外围地带(8)与该电路板(1)的相邻地带分离。根据本发明，裂缝生成和/或从电路板(1)的该要移除的子区域(6)的脱离在该防粘附或防粘结物料的层(7)内或上的子区域内开始，而该要移除的子区域(6)随后被移除，因而能够以简单且可靠，需要时为自动，的方式从电路板(1)移除要移除的子区域(6)。这样的方法的应用亦被公开，其用于生产多层电路板(1)和特别在这样的电路板(1)产生空隙。
摘要（英）：

The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids in such a circuit board (1).

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