A cambered surface spraying head applied to a semiconductor plasma processing device mainly solves the technical problems in the prior art that the uniformity is not good, and the gas utilization rate is lower. A spraying head forms a relative surface with an objective table, is arranged in a reaction chamber, and supplies a gas to the objective table in a spraying shape. The lower surface of the spraying head is an arc-shaped structure, namely, the distances between the parts of the lower surface of the spraying head and the objective table are not equal, and the distance d from a center to an edge is not a fixed value, but is a gradually varied value. A plurality of through holes are arranged in a spraying trepanning area of the spraying head and are used for the spraying-shaped supply of the gas, and the area of an cambered surface structure below the spraying head is 1% -100% of the area of the lower surface of the spraying head. By the cambered surface structure on the lower surface of the spraying head, the uniform processing of a semiconductor plasma processing process can be realized, the gas utilization rate can be improved effectively and simply, and the cambered surface spraying head applied to the semiconductor plasma processing device can be widely used in the semiconductor manufacture technology field.