The invention discloses a stepped groove circuit board and a processing method for the same in order to solve many technical problems in the prior art of manufacturing a stepped groove circuit board, wherein the stepped groove region of the stepped groove circuit board is provided with a metallized through hole . In some feasible embodiment, the processing method steps of arranging a pad on a first surface of a first plywood and laminating a second plywood, arranging an isolation protective film on a second surface of the first plywood and laminating a third plywood and performing lamination. wherein the first plywood has the metallized through hole positioned in the stepped groove region and the pad is arranged in the stepped groove region, making a groove on one side of the second layer plywood in the stepped groove region, wherein the depth of the groove reaches the pad, removing the pad to form the stepped groove, and removing the third layer plywood and the isolation protective film to make a stepped groove circuit board,wherein the bottom of the stepped groove has the metallized through hole.