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发明公开
CN105390403A 一种LTCC厚薄膜混合基板制造中的基板腔体填充方法 有权

一种LTCC厚薄膜混合基板制造中的基板腔体填充方法
摘要：
本发明公开了LTCC厚薄膜混合基板制造领域中的一种基板腔体填充方法—UV膜腔体填充法，包括UV膜厚度、热切成型所用的UV膜载体材料、UV膜外形尺寸、多层UV总厚度与腔体高度差等。采用本发明的技术方案，其工艺简单易行、基板腔体填充效果好。
摘要（英）：

The invention discloses a substrate chamber filling method-UV film chamber filling method in the manufacture field of a low-temperature co-fired ceramic (LTCC) thick-film mixed substrate. The substrate chamber filling method-UV film chamber filling method involves the parameters of UV film thickness, UV film carrier material for hot cutting forming, external dimension of the UV film, total thickness of multiple UV films, chamber height difference, etc. The substrate chamber filling method provided by the technical solution of the invention has advantages of simple process application and high substrate chamber filling effect.

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