The invention belongs to the technical field of MEMS (Micro-electromechanical Systems), and relates to a digital-output passive array MEMS sensor. The sensor comprises a silicon micromechanical sensing unit; the silicon micromechanical sensing unit comprises heavily doped ohmic contact areas (31, 34), a silicon cantilever (32) and a silicon contact block (33), wherein the silicon contact block (33) is fixed at one side of the silicon cantilever (32); one end of the silicon cantilever (32) and one side of the silicon contact block (33) are respectively provided with the heavily doped ohmic contact area; each functional area of the sensor includes an array consisting of a silicon micromechanical sensing unit; and after the sensor feels the change of the external environment, the contact state of the silicon cantilever (32) and the silicon contact block (33) in each silicon micromechanical sensing unit is outputted in parallel by a silicon micromechanical sensing unit array in each functional area. A novel digital-output passive array MEMS sensor is proposed, which solves the problem that the volume of an MEMS sensor is not easy to be reduced and the power consumption is difficult tobe reduced.