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发明公开
CN107819441A 高频功率放大器封装模块 审中-实审 转让

高频功率放大器封装模块
摘要：
本发明公开一种高频功率放大器封装模块，包括矩形波导及其盖板，所述矩形波导由上、下腔体拼合而成，所述盖板封扣合在下腔体背部；所述下腔体正面设置有石英探针过渡槽、芯片槽以及贯穿的直流馈电孔，背面设置有PCB背部器件凹槽；所述上腔体正面设置有与直流馈电孔位置对应的直流馈电凹槽；所述上、下腔体侧面拼合成输入输出安装法兰。该模块由盖板下腔体及上腔体组成，这样既兼顾了结构设计的简单化以及精密机械加工工的可能性，把矩形波导进行上下腔体剖分，降低了加工难度，但也能满足高频信号传输要求。
摘要（英）：

The invention discloses a high-frequency power amplifier. The high-frequency power amplifier comprises a rectangular waveguide and a cover plate thereof; the rectangular waveguide is formed by splicing an upper cavity and a lower cavity; the cover plate is buckled on the back of the lower cavity; a quartz probe transition slot, a chip slot and a through DC feed hole are formed on the frontage of the lower cavity, and a PCB back device groove is formed on the back; a DC feed groove corresponding to the DC feed hole is arranged on the frontage of the upper cavity; and an input/output mounting flange is formed by splicing the sides of the upper cavity and the lower cavity. The module disclosed by the invention is composed of the cover plate lower cavity and the upper cavity; the simplification of the structure design and the precision machining probability are both taken into considered, the rectangular waveguide is divided into the upper cavity and the lower cavity, the machining difficulty is reduced, and the high-frequency signal transmission requirement can be satisfied.

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