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发明公开
CN108074908A 半导体芯片 审中-实审

半导体芯片
摘要：
一种半导体芯片包括：半导体衬底，包括其中配置有凸块的凸块区及不包括凸块的非凸块区；以及钝化层，形成在所述半导体衬底的所述凸块区及所述非凸块区上，其中所述凸块区中所述钝化层的厚度厚于所述非凸块区中所述钝化层的厚度，且在所述凸块区与所述非凸块区之间具有台阶。所述半导体芯片具有提高的可靠性。
摘要（英）：

A semiconductor chip includes a semiconductor substrate including a bump region and a non-bump region, a bump on the bump region, and a passivation layer on the bump region and the non-bump region ofthe semiconductor substrate. No bump is on the non-bump region. A thickness of the passivation layer in the bump region is thicker than a thickness of the passivation layer in the non-bump region. Thepassivation layer includes a step between the bump region and the non-bump region. The semiconductor chip is characterized by improved reliability.

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