利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN108250975A 一种化学机械抛光液及其应用 审中-实审

一种化学机械抛光液及其应用
摘要：
本发明公开了一种高浓缩的化学机械抛光液及其应用，该抛光液包含二氧化硅颗粒、氨基硅烷类化合物、非离子表面活性剂。本发明的化学机械抛光液可以用于抛光二氧化硅、氮化硅和多晶硅，满足抛光过程中对各种材料的抛光速率和选择比要求，对硅片器件表面的平坦化有很强的矫正能力，能实现快速平坦化，提高工作效率，降低生产成本。
摘要（英）：

The invention discloses a highly-concentrated chemical mechanical polishing liquid and applications thereof, wherein the polishing liquid contains silica particles, an aminosilane compound and a nonionic surfactant. According to the present invention, the chemical mechanical polishing liquid can be used for polishing silicon dioxide, silicon nitride and polycrystalline silicon, can meet the requirements on the polishing rate and the selection ratio of various materials during polishing, can provide strong correction ability on the flattening of the surface of silicon wafer devices, and furtherhas advantages of rapid flattening, work efficiency improving and production cost reducing.

0/0