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发明公开
CN108305893A 半导体装置 有权

半导体装置
摘要：
本发明提供一种半导体装置，其为沟槽栅型半导体装置，能够充分消除耐压与通态电压的折中，还能够降低反馈电容。半导体装置具有：半导体基板，其层叠有第一半导体区域、第二半导体区域、第三半导体区域、以及第四半导体区域；绝缘膜，其配置于从第四半导体区域的上表面延伸并贯通第四半导体区域以及第三半导体区域而到达第二半导体区域的槽的内壁上；控制电极，其在槽的侧面与第三半导体区域的侧面对置地配置于绝缘膜上；第一主电极，其与第一半导体区域电连接；第二主电极，其与第三半导体区域以及第四半导体区域电连接；以及底面电极，其在槽的底面与控制电极间隔开地配置于绝缘膜之上，并与第二主电极电连接，在俯视观察时，槽在延伸方向上的长度在槽的宽度以上，且槽的宽度比相邻的槽之间的间隔大。
摘要（英）：

A semiconductor device includes: a first semiconductor region; a second semiconductor region; a third semiconductor region; a fourth semiconductor region; an insulation film, which is arranged on an inner wall of a recess that extends from an upper surface of the fourth semiconductor region and reaches the second semiconductor region with penetrating the fourth semiconductor region and the third semiconductor region; a control electrode, which is arranged on the insulation film on a side surface of the recess and faces the third semiconductor region; a first main electrode, which is electrically connected to the first semiconductor region, and a second main electrode, which is electrically connected to the fourth semiconductor region, wherein a ratio of a width of the recess to a width of the third semiconductor region contacting the second main electrode is 1 or larger.

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