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发明公开
CN108461427A 基板处理装置及基板处理方法 有权

基板处理装置及基板处理方法
摘要：
本发明提供可以实现处理性能的提高及处理液使用量的降低的基板处理装置及基板处理方法。实施方式的基板处理装置(1)具备：将双氧水的沸点以上的第1温度的硫酸溶液供给至基板(W)的第1溶液供给部(3a)；将作为硫酸溶液及双氧水的混合液且比第1温度低的第2温度的混合液供给至所述基板(W)的处理对象面(Wa)的第2溶液供给部(3b)；以及控制部(5)，该控制部按照使基板(W)的温度达到双氧水的沸点以上的方式使第1溶液供给部(3a)供给第1温度的硫酸溶液、在基板(W)的温度达到第2温度以上时，使第1溶液供给部(3a)停止第1温度的硫酸溶液的供给、使第2溶液供给部(3b)供给第2温度的混合液。
摘要（英）：

According to one embodiment, a substrate processing apparatus includes a first liquid supplier, a second liquid supplier, and a controller. The first liquid supplier supplies a substrate with a sulfuric acid solution having a first temperature equal to or higher than the boiling point of hydrogen peroxide water. The second liquid supplier supplies a surface to be treated of the substrate with a mixture of sulfuric acid solution and hydrogen peroxide water having a second temperature lower than the first temperature. The controller controls the first liquid supplier to supply the sulfuric acid solution so as to heat the substrate to the boiling point of hydrogen peroxide water or higher. When the temperature of the substrate becomes equal to or higher than the second temperature, the controller controls the first liquid supplier to stop supplying the sulfuric acid solution and controls the second liquid supplier to supply the mixture.

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