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发明公开
CN109427701A 半导体装置及其制造方法 有权

半导体装置及其制造方法
摘要：
本发明实施例涉及半导体装置及其制造方法。该半导体装置包含衬底、封装、第一导体及第二导体。所述衬底包含第一表面及与所述第一表面相对的第二表面。所述封装放置于所述衬底上方。所述第一导体放置于所述衬底上方。所述第二导体放置于所述衬底上方，其中所述第一导体及所述第二导体基本上处于同一层级，且所述第二导体的宽度大于所述第一导体的宽度。
摘要（英）：

The invention relates to a semiconductor device and a method of manufacturing the same. The semiconductor device includes a substrate, a package, first conductors and second conductors. The substrateincludes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors aredisposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.

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