The invention provides a semiconductor device. The invention provides a technique for reducing pressure concentration to the central part of the end surface of a stack through one spring in the semiconductor device which pressurizes in a laminating direction of the stack that accommodates a semiconductor module of a semiconductor element and a cooler. The semiconductor device includes a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor moduleand the cooler; and a spring contacting the contact plate and pressurizing the stack via the contact plate in the stacking direction, wherein the spring may contact a center portion of the contact plate in a direction perpendicular to the stacking direction, and a recess is arranged at the center portion of the contact plate, the recess facing the stack. In the semiconductor device, the central portion of the contact plate does not contact with the stack, and two sides of the central portion pressurizes the stack. Through pressurizing the stack at two sides of the central portion, deviation of the pressure to the central portion of the end surface of the stack is alleviated.