Provided is a component mounting system capable of improving yield and the like. A component mounting system 13 includes a first component mounting machine 42 for mounting, onto a solder printed on asubstrate, an electronic component having a predetermined electrode portion, and/or an inspection device 41 for inspecting an adhesive. In the first component mounting machine 42, in relation to an electronic component fixed by an adhesive which is cured at a temperature lower than the melting temperature of solder, the target mounting height is set to an ideal mounting height based on design data, or to a height which is lower than the ideal mounting height by an amount of sinking of the electronic component accompanying the melting of the solder. Regardless of the amount of solder, the inspection device 41 determines whether the height of the adhesive is the ideal mounting height or the like of the electronic component based on the design data, thereby determining whether the adhesive isacceptable or not.