The invention provides a method for further increasing an inspection speed, i.e. increasing the productivity of the inspection device in an SEM manner. The inspection device which inspects the surface of a substrate images in the direction of a sample W with expected times to form crossover after an electron generated from an electron source (25*1) forms crossover. When allowing the crossover to pass through, an electron as noise is removed from an opening, the crossover is set to be expected times and adjusted to be parallel electron beams to irradiate a substrate with a desired sectional shape. The electron beam is adjusted so as to keep unevenness in electron beam illumination intensity to up to 10%. Electrons emitted from the sample W are detected by a detector (25*11).