The method comprises: providing a flexible baseplate made by sequentially stacking a polyamide baseplate, an alloy layer and a first copper layer; making first photo etching, and patterning the first copper layer and the alloy layer in order to form multi first conducting wire structures on the polyamide baseboard; forming second copper layer on the polyamide baseplate and the first conducting wire structures; finally, making the second photo etching to remove the second copper layer on the polyamide baseplate.