A heating device provided with a cooling plate and a heating plate is formed in a low height, and floats a substrate above the cooling plate and the heating plate and moves the substrate horizontally between the cooling plate and the heating plate by the pressure of a gas. A heating device 2 includes a cooling plate 3 provided with flotation gas spouting ports 3 a, and a heating plate 6 provided with flotation gas spouting ports 3b. The flotation gas spouting ports 3 a and 3 b are arranged along a wafer moving passage and are formed so as to spout the gas obliquely upward toward a first end of the wafer w moving passage on the side of the cooling plate 3. A pushing member 51 is brought into contact with a back part of a wafer W with respect to a direction in which the wafer W is moved to move the wafer W in a direction toward the heating plate 6 opposite a direction in which the flotation gas is spouted. Or the pushing member 51 is brought into contact with a front part of a wafer W with respect to a direction in which the wafer W is moved to move the wafer W in a direction toward the cooling plate 3 in which the flotation gas is spouted.