发明公开
EP0169060A2 Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them
失效
可焊接的导电性组合物，它们作为在基材上的组合物和适用于它们的形成涂料。
- 专利标题： Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them
- 专利标题（中）： 可焊接的导电性组合物，它们作为在基材上的组合物和适用于它们的形成涂料。
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申请号： EP85305082.1申请日： 1985-07-17
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公开(公告)号： EP0169060A2公开(公告)日： 1986-01-22
- 发明人: St. John, Frank , Shahbazi, Sanson
- 申请人： ELECTRO MATERIALS CORP. OF AMERICA
- 申请人地址： 605 Center Avenue Mamaroneck New York 10543 US
- 专利权人： ELECTRO MATERIALS CORP. OF AMERICA
- 当前专利权人： ELECTRO MATERIALS CORP. OF AMERICA
- 当前专利权人地址： 605 Center Avenue Mamaroneck New York 10543 US
- 代理机构： Angell, David Whilton
- 优先权： US631974 19840718
- 主分类号： H01B1/22
- IPC分类号： H01B1/22
摘要：
This invention is concerned with directly solderable conductive compositions which may be bonded directly to substrates. The conductive compositions comprise silver, substantially in the form of flake, and resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. This invention is also concerned with compositions useful in forming conductive compositions and the coating of at least a portion of the surface of substrates with conductive compositions.
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