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1.发明授权Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them 失效可焊性导电组合物，它们作为基材上的涂料，以及有用的成分组合物
公开(公告)号：EP0169060B1
公开(公告)日：1988-08-31
申请号：EP85305082.1
申请日：1985-07-17
发明人： St. John, Frank , Shahbazi, Sanson
IPC分类号： H01B1/22
CPC分类号： C08K3/08 , H01B1/22 , H05K1/095 , Y10S428/901
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2.发明公开Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them 失效可焊接的导电性组合物，它们作为在基材上的组合物和适用于它们的形成涂料。
公开(公告)号：EP0169060A2
公开(公告)日：1986-01-22
申请号：EP85305082.1
申请日：1985-07-17
发明人： St. John, Frank , Shahbazi, Sanson
IPC分类号： H01B1/22
CPC分类号： C08K3/08 , H01B1/22 , H05K1/095 , Y10S428/901
摘要： This invention is concerned with directly solderable conductive compositions which may be bonded directly to substrates. The conductive compositions comprise silver, substantially in the form of flake, and resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. This invention is also concerned with compositions useful in forming conductive compositions and the coating of at least a portion of the surface of substrates with conductive compositions.
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3.发明公开Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them 失效可焊接的导电组合物，它们作为基材上的涂料，以及有用的成分组合物
公开(公告)号：EP0169060A3
公开(公告)日：1986-08-27
申请号：EP85305082
申请日：1985-07-17
发明人： St. John, Frank , Shahbazi, Sanson
IPC分类号： H01B01/22
CPC分类号： C08K3/08 , H01B1/22 , H05K1/095 , Y10S428/901
摘要： This invention is concerned with directly solderable conductive compositions which may be bonded directly to substrates. The conductive compositions comprise silver, substantially in the form of flake, and resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. This invention is also concerned with compositions useful in forming conductive compositions and the coating of at least a portion of the surface of substrates with conductive compositions.
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