-
1.发明授权Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them 失效可焊性导电组合物，它们作为基材上的涂料，以及有用的成分组合物
公开(公告)号：EP0169060B1
公开(公告)日：1988-08-31
申请号：EP85305082.1
申请日：1985-07-17
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： St. John, Frank , Shahbazi, Sanson
IPC: H01B1/22
CPC classification number: C08K3/08 , H01B1/22 , H05K1/095 , Y10S428/901
-
公开(公告)号：EP0161805A1
公开(公告)日：1985-11-21
申请号：EP85302569.0
申请日：1985-04-12
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Lane, George , Martin, Frank Wayne , St. John, Frank
CPC classification number: H05K1/095 , C08K3/08 , H01B1/22 , H01B1/24 , H01C7/005 , H05K1/0293 , H05K3/242 , H05K2203/162 , H05K2203/175
Abstract: The invention concerns a composition which may be used to form a temporary conductor or resistor, for example, by screen printing onto selected parts of an electrical circuit and peeled off when desired. The composition comprises vinylic resin, wax, solvent, and conductive and/or semiconductive particles.
Abstract translation: 本发明涉及可用于形成临时导体或电阻器的组合物，例如通过丝网印刷到电路的选定部分上并在需要时剥离。 该组合物包括乙烯树脂，蜡，溶剂以及导电和/或半导电颗粒。
-
3.发明公开A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself 失效一种用于在衬底和导电材料上产生可焊接的导电膜的方法。
公开(公告)号：EP0143531A1
公开(公告)日：1985-06-05
申请号：EP84306618.4
申请日：1984-09-28
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , St. John, Frank
Abstract: A solderable electrically conductive film is formed on a substrate by forming a film-forming composition comprising polyimide, solvent therefor and dispersed metallic nickel particles. This composition is applied to the substrate, dried and cured to leave the film which comprises nickel particles dispersed in polyimide.
Abstract translation: 可焊接的导电膜是通过形成成膜组合物，其包括聚酰亚胺，溶剂为此形成于基材和分散的金属镍粒子。 该组合物被施加到基板，干燥并固化以离开其包含分散在聚酰亚胺化镍颗粒的膜。
-
4.发明授权
公开(公告)号：EP0170468B1
公开(公告)日：1989-01-18
申请号：EP85305083.9
申请日：1985-07-17
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson
CPC classification number: H01C7/005 , H01C17/0652 , H01C17/06586
-
公开(公告)号：EP0159873A3
公开(公告)日：1987-05-27
申请号：EP85302570
申请日：1985-04-12
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , St. John, Frank
CPC classification number: H05K3/0076 , B23K35/224 , C09D5/008 , C09D157/00 , H05K3/3452 , H05K2201/0166 , H05K2203/0264 , C08L2666/02
Abstract: The invention concerns a coating composition which may be used to form a peelable solder mask. The coating composition comprises a mixture of vinylic resin, microcrystalline wax and solvent. Applied as a film coating, the coating composition can be used to provide a temporary mask to selected areas of a substrate, for example, a printed circuit, prior to exposure to a solder flux, the mask being readily peelable from the substrate.
-
Patent Agency Ranking6.发明公开Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates 失效柔性，直接可焊接的导电组合物，有助于形成它们的组合物及其作为基材上的涂料
公开(公告)号：EP0169059A3
公开(公告)日：1986-08-20
申请号：EP85305081
申请日：1985-07-17
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson
IPC: H01B01/22
CPC classification number: H05K1/095 , C08K3/08 , H01B1/22 , Y10S428/901 , C08L27/06
Abstract: This invention provides solderable, flexible, conductive compositions which may be bonded directly to substrates. The conductive compositions comprise silver, substantially in the form of flake, and resin system, said resin system comprising vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. Also provided are methods of preparing compositions useful in forming conductive compositions. Once cured, the conductive compositions may demonstrate good adhesion directly to a substrate in addition to excellent conductivity, solderability and felxibility characteristics.
-
7.发明公开Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them 失效可焊接的导电性组合物，它们作为在基材上的组合物和适用于它们的形成涂料。
公开(公告)号：EP0169060A2
公开(公告)日：1986-01-22
申请号：EP85305082.1
申请日：1985-07-17
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： St. John, Frank , Shahbazi, Sanson
IPC: H01B1/22
CPC classification number: C08K3/08 , H01B1/22 , H05K1/095 , Y10S428/901
Abstract: This invention is concerned with directly solderable conductive compositions which may be bonded directly to substrates. The conductive compositions comprise silver, substantially in the form of flake, and resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. This invention is also concerned with compositions useful in forming conductive compositions and the coating of at least a portion of the surface of substrates with conductive compositions.
-
8.发明公开Solderable conductive compositions, methods for their preparation, and substrates coated with them 失效可焊接的导电组合物，其制备方法以及用相同的扫过基板的方法。
公开(公告)号：EP0162698A1
公开(公告)日：1985-11-27
申请号：EP85303563.2
申请日：1985-05-21
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： St. John, Frank , Martin, Frank Wayne
CPC classification number: H05K1/095 , C08K9/04 , C09D5/24 , H01B1/22 , Y10T428/24802 , Y10T428/24917
Abstract: This invention is concerned with solderable conductive compositions. These compositions comprise metal and/or alloy thereof coated with one or more saturated monocarboxylic acid, the coated metal and/or alloy thereof being dispersed in organic polymeric matrix. Also disclosed is a method for preparing such solderable conductive compositions, and a method of coating metal and/or alloy thereof with one or more saturated monocarboxylic acid.
-
9.发明公开Coating composition and method for partially soldering a substrate 失效Überzugzusammensetzungund Verfahren zum teilweisenLöteneines Substrats。
公开(公告)号：EP0159873A2
公开(公告)日：1985-10-30
申请号：EP85302570.8
申请日：1985-04-12
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , St. John, Frank
CPC classification number: H05K3/0076 , B23K35/224 , C09D5/008 , C09D157/00 , H05K3/3452 , H05K2201/0166 , H05K2203/0264 , C08L2666/02
Abstract: The invention concerns a coating composition which may be used to form a peelable solder mask. The coating composition comprises a mixture of vinylic resin, microcrystalline wax and solvent. Applied as a film coating, the coating composition can be used to provide a temporary mask to selected areas of a substrate, for example, a printed circuit, prior to exposure to a solder flux, the mask being readily peelable from the substrate.
Abstract translation: 本发明涉及可用于形成可剥离焊料掩模的涂料组合物。 涂料组合物包括乙烯基树脂，微晶蜡和溶剂的混合物。 作为膜涂层，涂料组合物可以用于在暴露于焊剂之前在衬底（例如印刷电路）的选定区域提供临时掩模，掩模容易从衬底剥离。
-
10.发明授权Solderable conductive compositions, methods for their preparation, and substrates coated with them 失效可焊接的导电组合物，其制备方法和与其贴合的基材
公开(公告)号：EP0162698B1
公开(公告)日：1990-04-25
申请号：EP85303563.2
申请日：1985-05-21
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： St. John, Frank , Martin, Frank Wayne
CPC classification number: H05K1/095 , C08K9/04 , C09D5/24 , H01B1/22 , Y10T428/24802 , Y10T428/24917
-
-
-
-
-
-
-
-
-
Search Results
18
records
(took 0.013 seconds)
