发明公开
- 专利标题： Resin glass filled deep trench isolation
- 专利标题（中）： 树脂玻璃填充深度分离
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申请号： EP86104052.5申请日： 1986-03-25
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公开(公告)号： EP0197422A3公开(公告)日： 1989-10-25
- 发明人: Chiu, George Tein-Chu , Mo, Roy Ah-Tak , Wong, Man-Chong
- 申请人： International Business Machines Corporation
- 申请人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 代理机构： Mönig, Anton, Dipl.-Ing.
- 优先权： US719848 19850404
- 主分类号： H01L21/76
- IPC分类号： H01L21/76 ; H01L21/312 ; H01L21/316
摘要：
A method of forming trench/dielectric by coating trench walls and substrate surface with MgO followed by filling the trenches with a resin glass. The MgO layer is used for RIE planarization etchback of the resin glass to level of the trenches.
公开/授权文献
- EP0197422B1 Resin glass filled deep trench isolation 公开/授权日：1992-05-27
信息查询
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