发明公开
EP0355955A2 Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
失效
布线由包覆电线和它们的制备方法的半导体器件或集成电路。
- 专利标题： Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
- 专利标题（中）： 布线由包覆电线和它们的制备方法的半导体器件或集成电路。
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申请号： EP89305884.2申请日： 1989-06-12
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公开(公告)号： EP0355955A2公开(公告)日： 1990-02-28
- 发明人: Okikawa, Susumu , Watanabe, Hiroshi , Tanimoto, Michio , Homma, Makoto , Kaneda, Tsuyoshi , Koike, Shunji , Nishita, Takafumi 202 Hitachimaikon
- 申请人： HITACHI, LTD. , HITACHI MICROCOMPUTER SYSTEM LTD.
- 申请人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 专利权人： HITACHI, LTD.,HITACHI MICROCOMPUTER SYSTEM LTD.
- 当前专利权人： HITACHI, LTD.,HITACHI MICROCOMPUTER SYSTEM LTD.
- 当前专利权人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 代理机构： Calderbank, Thomas Roger
- 优先权： JP190163/88 19880729; JP289237/88 19881116; JP185993/88 19880725; JP86841/89 19890407
- 主分类号： H01B3/30
- IPC分类号： H01B3/30 ; H01B13/16 ; H01L23/49 ; H01L21/60 ; H01L23/29
摘要：
A semiconductor integrated circuit device (2) in which wire bonding is applied by using a bonding wire (5) having heat resistant polyurethane coating (5B), a semiconductor integrated circuit device applied with bonding by way of a coated wire and encapsulated with a resin composition (6) of a low heat expansion coefficient, and a semiconductor integrated circuit device free from disconnection and damage to the coated wire by applying chamfering to a chip, etc.
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