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1.发明公开Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same 失效用于半导体器件的连接或通过涂覆线的集成电路的连接及其制造方法
公开(公告)号：EP0355955A3
公开(公告)日：1991-12-27
申请号：EP89305884.2
申请日：1989-06-12
发明人： Okikawa, Susumu , Watanabe, Hiroshi , Tanimoto, Michio , Homma, Makoto , Kaneda, Tsuyoshi , Koike, Shunji , Nishita, Takafumi 202 Hitachimaikon
CPC分类号： H01L24/85 , H01L21/56 , H01L23/4952 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/745 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05554 , H01L2224/05624 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45572 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/745 , H01L2224/78251 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/7865 , H01L2224/83805 , H01L2224/85045 , H01L2224/85075 , H01L2224/851 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/85948 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10157 , H01L2924/10253 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H01L2924/20753 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/01026 , H01L2924/3512 , H01L2224/48824 , H01L2924/00015 , H01L2924/01205 , H01L2224/83205 , H01L2924/069 , H01L2924/07025 , H01L2924/0675 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor integrated circuit device (2) in which wire bonding is applied by using a bonding wire (5) having heat resistant polyurethane coating (5B), a semiconductor integrated circuit device applied with bonding by way of a coated wire and encapsulated with a resin composition (6) of a low heat expansion coefficient, and a semiconductor integrated circuit device free from disconnection and damage to the coated wire by applying chamfering to a chip, etc.
摘要翻译： 一种半导体集成电路器件（2），其中通过使用具有耐热聚氨酯涂层（5B）的接合线（5）施加引线接合，半导体集成电路器件通过涂覆线施加粘合并被树脂封装 具有低热膨胀系数的组成（6），以及通过对芯片等进行倒角而没有断开和损坏涂层线的半导体集成电路装置。
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2.发明公开Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same 失效布线由包覆电线和它们的制备方法的半导体器件或集成电路。
公开(公告)号：EP0355955A2
公开(公告)日：1990-02-28
申请号：EP89305884.2
申请日：1989-06-12
发明人： Okikawa, Susumu , Watanabe, Hiroshi , Tanimoto, Michio , Homma, Makoto , Kaneda, Tsuyoshi , Koike, Shunji , Nishita, Takafumi 202 Hitachimaikon
CPC分类号： H01L24/85 , H01L21/56 , H01L23/4952 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/745 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05554 , H01L2224/05624 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45572 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/745 , H01L2224/78251 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/7865 , H01L2224/83805 , H01L2224/85045 , H01L2224/85075 , H01L2224/851 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/85948 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10157 , H01L2924/10253 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H01L2924/20753 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/01026 , H01L2924/3512 , H01L2224/48824 , H01L2924/00015 , H01L2924/01205 , H01L2224/83205 , H01L2924/069 , H01L2924/07025 , H01L2924/0675 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor integrated circuit device (2) in which wire bonding is applied by using a bonding wire (5) having heat resistant polyurethane coating (5B), a semiconductor integrated circuit device applied with bonding by way of a coated wire and encapsulated with a resin composition (6) of a low heat expansion coefficient, and a semiconductor integrated circuit device free from disconnection and damage to the coated wire by applying chamfering to a chip, etc.
摘要翻译： 一种半导体集成电路装置（2），引线接合是通过使用（5），其具有耐热性的聚氨酯涂料（5B）的接合线，通过被覆电线的方式与接合施加，并用树脂封装的半导体集成电路器件中的应用 组合物（6）低的热膨胀系数，和从断开和损坏包覆线自由的半导体集成电路装置通过施加倒角到芯片的等
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