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1.发明公开Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same 失效用于半导体器件的连接或通过涂覆线的集成电路的连接及其制造方法
公开(公告)号：EP0355955A3
公开(公告)日：1991-12-27
申请号：EP89305884.2
申请日：1989-06-12
发明人： Okikawa, Susumu , Watanabe, Hiroshi , Tanimoto, Michio , Homma, Makoto , Kaneda, Tsuyoshi , Koike, Shunji , Nishita, Takafumi 202 Hitachimaikon
CPC分类号： H01L24/85 , H01L21/56 , H01L23/4952 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/745 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05554 , H01L2224/05624 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45572 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/745 , H01L2224/78251 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/7865 , H01L2224/83805 , H01L2224/85045 , H01L2224/85075 , H01L2224/851 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/85948 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10157 , H01L2924/10253 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H01L2924/20753 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/01026 , H01L2924/3512 , H01L2224/48824 , H01L2924/00015 , H01L2924/01205 , H01L2224/83205 , H01L2924/069 , H01L2924/07025 , H01L2924/0675 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor integrated circuit device (2) in which wire bonding is applied by using a bonding wire (5) having heat resistant polyurethane coating (5B), a semiconductor integrated circuit device applied with bonding by way of a coated wire and encapsulated with a resin composition (6) of a low heat expansion coefficient, and a semiconductor integrated circuit device free from disconnection and damage to the coated wire by applying chamfering to a chip, etc.
摘要翻译： 一种半导体集成电路器件（2），其中通过使用具有耐热聚氨酯涂层（5B）的接合线（5）施加引线接合，半导体集成电路器件通过涂覆线施加粘合并被树脂封装 具有低热膨胀系数的组成（6），以及通过对芯片等进行倒角而没有断开和损坏涂层线的半导体集成电路装置。
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2.发明公开Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same 失效布线由包覆电线和它们的制备方法的半导体器件或集成电路。
公开(公告)号：EP0355955A2
公开(公告)日：1990-02-28
申请号：EP89305884.2
申请日：1989-06-12
发明人： Okikawa, Susumu , Watanabe, Hiroshi , Tanimoto, Michio , Homma, Makoto , Kaneda, Tsuyoshi , Koike, Shunji , Nishita, Takafumi 202 Hitachimaikon
CPC分类号： H01L24/85 , H01L21/56 , H01L23/4952 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/745 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05554 , H01L2224/05624 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45572 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/745 , H01L2224/78251 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/7865 , H01L2224/83805 , H01L2224/85045 , H01L2224/85075 , H01L2224/851 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/85948 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10157 , H01L2924/10253 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H01L2924/20753 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/01026 , H01L2924/3512 , H01L2224/48824 , H01L2924/00015 , H01L2924/01205 , H01L2224/83205 , H01L2924/069 , H01L2924/07025 , H01L2924/0675 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor integrated circuit device (2) in which wire bonding is applied by using a bonding wire (5) having heat resistant polyurethane coating (5B), a semiconductor integrated circuit device applied with bonding by way of a coated wire and encapsulated with a resin composition (6) of a low heat expansion coefficient, and a semiconductor integrated circuit device free from disconnection and damage to the coated wire by applying chamfering to a chip, etc.
摘要翻译： 一种半导体集成电路装置（2），引线接合是通过使用（5），其具有耐热性的聚氨酯涂料（5B）的接合线，通过被覆电线的方式与接合施加，并用树脂封装的半导体集成电路器件中的应用 组合物（6）低的热膨胀系数，和从断开和损坏包覆线自由的半导体集成电路装置通过施加倒角到芯片的等
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公开(公告)号：EP0276564A1
公开(公告)日：1988-08-03
申请号：EP87311245.2
申请日：1987-12-21
申请人： HITACHI, LTD.
发明人： Nakajima, Makoto , Ohashi, Yosho , Chuma, Toshio No. D-101, Hitachikaminakaishataku , Hatori, Kazuo , Araki, Isao , Onuki, Jin , Koizumi, Masahiro , Suzuki, Hitoshi , Okikawa, Susumu
CPC分类号： H01L24/85 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73265 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85099 , H01L2224/851 , H01L2224/85181 , H01L2224/85205 , H01L2224/85424 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01079 , H01L2924/01083 , H01L2924/01204 , H01L2924/01205 , H01L2924/10253 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H01L2924/3025 , H01L2924/00014 , H01L2924/01001 , H01L2924/00012 , H01L2924/00 , H01L2224/48824 , H01L2924/20752 , H01L2924/20755 , H01L2924/20758 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754
摘要： In ball bonding, a ball (112) is formed on the end of a wire (105) by an electric discharge between the wire (105) and a discharge electrode (116). The ball (112) is subsequently pressed onto a pad of a semiconductor pellet and bonded thereto by press bonding under heat with the application of ultrasonic vibrations. However, the pressing of the ball onto the pad may damage the pellet if the ball (112) is too hard. Therefore, a reducing gas (121) is supplied to the environs of the ball (112) during its formation, the gas being supplied at a temperature preferably between 100°C and 200°C. This shows the cooling of the ball (112) resulting in a finer cyrstal structure, and a lower hardness. Hence the occurrence of cracking of the pellet is reduced.
摘要翻译： 在球接合中，通过线（105）和放电电极（116）之间的放电，在导线（105）的端部上形成球（112）。 随后将球（112）压在半导体芯片的焊盘上，并通过施加超声振动的加热粘合。 然而，如果球（112）太硬，则将球压到垫上可能损坏球团。 因此，在其形成期间，将还原气体（121）供应到球体（112）的周围，该气体优选在100℃至200℃之间的温度下供给。这表示球体（112）的冷却， 导致更精细的晶体结构和较低的硬度。 因此，颗粒的破裂的发生减少。
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公开(公告)号：EP0276928B1
公开(公告)日：1994-10-26
申请号：EP88300315.4
申请日：1988-01-15
申请人： HITACHI, LTD.
发明人： Okikawa, Susumu , Tanimoto, Michio
CPC分类号： H01L24/85 , B23K20/007 , B23K20/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/02166 , H01L2224/05599 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45686 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/73265 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/85045 , H01L2224/85075 , H01L2224/85099 , H01L2224/851 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01031 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01052 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20753 , H01L2924/20756 , H01L2924/30105 , H01L2924/3025 , H01L2924/20752 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/85399
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公开(公告)号：EP0276928A2
公开(公告)日：1988-08-03
申请号：EP88300315.4
申请日：1988-01-15
申请人： HITACHI, LTD.
发明人： Okikawa, Susumu , Tanimoto, Michio
CPC分类号： H01L24/85 , B23K20/007 , B23K20/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/02166 , H01L2224/05599 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45686 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/73265 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/85045 , H01L2224/85075 , H01L2224/85099 , H01L2224/851 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01031 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01052 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20753 , H01L2924/20756 , H01L2924/30105 , H01L2924/3025 , H01L2924/20752 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/85399
摘要： When bonding a coated wire to a bonding site, a mixed gas is formed which consists of a combustible gas and a temperature controlling gas for lowering the combustion temperature of the combustible gas, and removing insulator at a bonding part of the coated wire and thus denuding the surface of a metal wire by the use of burning flames produced by the combustion of the combustible gas of the mixed gas. The removal of the insulator is executed by an insulator removal torch. Also, a metal ball may be formed on an end of the coated wire, the metal ball being joined to the bonding site, e.g. an external terminal of a semiconductor chip. A further part of the side of the coated wire into touch with an external drawing lead of the chip and the insulator at the contact part. Then the further part of the wire may be bonded to the lead. Thus the combustion flames (which do not damage or cause breakdown of the metal wire) will surround substantially the whole area of the bonding part of the coated wire, so that the insulator of the wire can be reliably removed. This reduces bonding defects. Moreover, the melting and shrinking insulator of the coated wire may be blown away, to prevent globes of insulator globes being formed on the wire.
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公开(公告)号：EP0276564B1
公开(公告)日：1992-03-11
申请号：EP87311245.2
申请日：1987-12-21
申请人： HITACHI, LTD.
发明人： Nakajima, Makoto , Ohashi, Yosho , Chuma, Toshio No. D-101, Hitachikaminakaishataku , Hatori, Kazuo , Araki, Isao , Onuki, Jin , Koizumi, Masahiro , Suzuki, Hitoshi , Okikawa, Susumu
CPC分类号： H01L24/85 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05624 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73265 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85099 , H01L2224/851 , H01L2224/85181 , H01L2224/85205 , H01L2224/85424 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01079 , H01L2924/01083 , H01L2924/01204 , H01L2924/01205 , H01L2924/10253 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H01L2924/3025 , H01L2924/00014 , H01L2924/01001 , H01L2924/00012 , H01L2924/00 , H01L2224/48824 , H01L2924/20752 , H01L2924/20755 , H01L2924/20758 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754
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公开(公告)号：EP0276928A3
公开(公告)日：1990-08-22
申请号：EP88300315.4
申请日：1988-01-15
申请人： HITACHI, LTD.
发明人： Okikawa, Susumu , Tanimoto, Michio
CPC分类号： H01L24/85 , B23K20/007 , B23K20/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/02166 , H01L2224/05599 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45686 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/73265 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/85045 , H01L2224/85075 , H01L2224/85099 , H01L2224/851 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01031 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01052 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20753 , H01L2924/20756 , H01L2924/30105 , H01L2924/3025 , H01L2924/20752 , H01L2924/01004 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/85399
摘要： When bonding a coated wire to a bonding site, a mixed gas is formed which consists of a combustible gas and a temperature controlling gas for lowering the combustion temperature of the combustible gas, and removing insulator at a bonding part of the coated wire and thus denuding the surface of a metal wire by the use of burning flames produced by the combustion of the combustible gas of the mixed gas. The removal of the insulator is executed by an insulator removal torch. Also, a metal ball may be formed on an end of the coated wire, the metal ball being joined to the bonding site, e.g. an external terminal of a semiconductor chip. A further part of the side of the coated wire into touch with an external drawing lead of the chip and the insulator at the contact part. Then the further part of the wire may be bonded to the lead. Thus the combustion flames (which do not damage or cause breakdown of the metal wire) will surround substantially the whole area of the bonding part of the coated wire, so that the insulator of the wire can be reliably removed. This reduces bonding defects. Moreover, the melting and shrinking insulator of the coated wire may be blown away, to prevent globes of insulator globes being formed on the wire.
摘要翻译： 当将涂覆的线粘合到结合部位时，形成由可燃气体和用于降低可燃气体的燃烧温度的温度调节气体组成的混合气体，并且在涂覆的电线的接合部分去除绝缘体，从而剥离 通过使用由混合气体的可燃气体的燃烧产生的燃烧火焰的金属线的表面。 绝缘体的去除由绝缘体去除焊炬执行。 此外，金属球可以形成在涂覆线的端部上，金属球接合到结合位置，例如， 半导体芯片的外部端子。 涂层线的另一部分与芯片的外部引导线和接触部分处的绝缘体接触。 然后线的另一部分可以结合到引线。 因此，燃烧火焰（其不损坏或导致金属丝的击穿）将围绕涂覆线的接合部分的整个区域围绕，从而可以可靠地去除线的绝缘体。 这减少了接合缺陷。 此外，涂覆线材的熔化和收缩的绝缘体可以被吹走，以防止绝缘体球体在导线上形成。
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