发明公开
EP0355955A3 Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
失效
用于半导体器件的连接或通过涂覆线的集成电路的连接及其制造方法
- 专利标题： Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
- 专利标题（中）： 用于半导体器件的连接或通过涂覆线的集成电路的连接及其制造方法
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申请号： EP89305884.2申请日： 1989-06-12
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公开(公告)号： EP0355955A3公开(公告)日： 1991-12-27
- 发明人: Okikawa, Susumu , Watanabe, Hiroshi , Tanimoto, Michio , Homma, Makoto , Kaneda, Tsuyoshi , Koike, Shunji , Nishita, Takafumi 202 Hitachimaikon
- 申请人： HITACHI, LTD. , HITACHI MICROCOMPUTER SYSTEM LTD.
- 申请人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 专利权人： HITACHI, LTD.,HITACHI MICROCOMPUTER SYSTEM LTD.
- 当前专利权人： HITACHI, LTD.,HITACHI MICROCOMPUTER SYSTEM LTD.
- 当前专利权人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 代理机构： Calderbank, Thomas Roger
- 优先权： JP190163/88 19880729; JP289237/88 19881116; JP185993/88 19880725; JP86841/89 19890407
- 主分类号： H01B3/30
- IPC分类号： H01B3/30 ; H01B13/16 ; H01L23/49 ; H01L21/60 ; H01L23/29
摘要：
A semiconductor integrated circuit device (2) in which wire bonding is applied by using a bonding wire (5) having heat resistant polyurethane coating (5B), a semiconductor integrated circuit device applied with bonding by way of a coated wire and encapsulated with a resin composition (6) of a low heat expansion coefficient, and a semiconductor integrated circuit device free from disconnection and damage to the coated wire by applying chamfering to a chip, etc.
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