发明公开
- 专利标题： Direct mount semiconductor package
- 专利标题（中）： Halbleiterpackungfürdirekte Montierung。
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申请号： EP90308888.8申请日： 1990-08-13
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公开(公告)号： EP0413542A2公开(公告)日： 1991-02-20
- 发明人: Chiu, Anthony , Test, Howard
- 申请人： TEXAS INSTRUMENTS INCORPORATED
- 申请人地址： 13500 North Central Expressway Dallas Texas 75265 US
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： 13500 North Central Expressway Dallas Texas 75265 US
- 代理机构： Abbott, David John
- 优先权： US394042 19890815
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/60
摘要：
A semiconductor package structure allows testing and includes a fuse link (19) to indicate a short circuit in a semiconductor device (14) before it is incorporated into a circuit. The package structure allows mounting a semiconductor device (14) entire within an opening in a printed circuit board (25) and permits stacking of printed circuit board in a minimum thickness configuration.
公开/授权文献
- EP0413542A3 Direct mount semiconductor package 公开/授权日：1991-12-04
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