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公开(公告)号:EP0413542A3
公开(公告)日:1991-12-04
申请号:EP90308888.8
申请日:1990-08-13
发明人: Chiu, Anthony , Test, Howard
IPC分类号: H01L23/498 , H01L21/60
CPC分类号: G01R31/2863 , H01L22/32 , H01L23/49572 , H01L24/63 , H01L25/105 , H01L2224/32188 , H01L2224/50 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/01029 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/182 , H01L2924/00
摘要: A semiconductor package structure allows testing and includes a fuse link (19) to indicate a short circuit in a semiconductor device (14) before it is incorporated into a circuit. The package structure allows mounting a semiconductor device (14) entire within an opening in a printed circuit board (25) and permits stacking of printed circuit board in a minimum thickness configuration.
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公开(公告)号:EP0413542A2
公开(公告)日:1991-02-20
申请号:EP90308888.8
申请日:1990-08-13
发明人: Chiu, Anthony , Test, Howard
IPC分类号: H01L23/498 , H01L21/60
CPC分类号: G01R31/2863 , H01L22/32 , H01L23/49572 , H01L24/63 , H01L25/105 , H01L2224/32188 , H01L2224/50 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/01029 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/182 , H01L2924/00
摘要: A semiconductor package structure allows testing and includes a fuse link (19) to indicate a short circuit in a semiconductor device (14) before it is incorporated into a circuit. The package structure allows mounting a semiconductor device (14) entire within an opening in a printed circuit board (25) and permits stacking of printed circuit board in a minimum thickness configuration.
摘要翻译: 半导体封装结构允许测试并且包括熔丝链路(19),以在其被并入电路之前指示半导体器件(14)中的短路。 封装结构允许将半导体器件(14)整体安装在印刷电路板(25)中的开口内,并允许以最小厚度配置堆叠印刷电路板。
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