发明公开
- 专利标题： Low inductance semiconductor package
- 专利标题（中）： Halbleiterpackung von niedriger Induktanz。
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申请号： EP93120273.3申请日： 1993-12-16
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公开(公告)号： EP0609528A1公开(公告)日： 1994-08-10
- 发明人: Pinder, Brent W. , Berringer, Kenneth A.
- 申请人： MOTOROLA, INC.
- 申请人地址： 1303 East Algonquin Road Schaumburg, IL 60196 US
- 专利权人： MOTOROLA, INC.
- 当前专利权人： MOTOROLA, INC.
- 当前专利权人地址： 1303 East Algonquin Road Schaumburg, IL 60196 US
- 代理机构： Hudson, Peter David
- 优先权： US11575 19930201
- 主分类号： H01L25/07
- IPC分类号： H01L25/07 ; H01L23/498 ; H01L23/31
摘要：
A low inductance semiconductor package (33) for housing at least two semiconductor die comprising a heat sink (11), an insulative material (13), a plurality of package leads (22), a frame (19), a cap (21), and an encapsulation material (23). At least three parallel metal stripes (26-29) are patterned on a surface (15) of the insulative material (13) providing interconnect for the at least two semiconductor die. Each of the plurality of package leads (22) directly connect to a corresponding metal stripe of the at least three metal stripes (26-29) minimizing parasitic inductance.
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