发明授权
- 专利标题： FABRICATING STACKS OF IC CHIPS BY SEGMENTING A LARGER STACK
- 专利标题（中）： 芯片堆栈均通过分割GREATER桩生产
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申请号： EP94909418.9申请日： 1993-12-16
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公开(公告)号： EP0676087B1公开(公告)日： 2003-11-12
- 发明人: MINIHAN, Joseph, A. , PEPE, Angel, A.
- 申请人： IRVINE SENSORS CORPORATION
- 申请人地址： 3001 Redhill Avenue, Bldg. 3 Costa Mesa, CA 92626 US
- 专利权人： IRVINE SENSORS CORPORATION
- 当前专利权人： IRVINE SENSORS CORPORATION
- 当前专利权人地址： 3001 Redhill Avenue, Bldg. 3 Costa Mesa, CA 92626 US
- 代理机构： Fiener, Josef
- 优先权： US996794 19921224
- 国际公布： WO94015358 19940707
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; H01L21/60 ; H01L25/065 ; H01L21/98
摘要：
A method for fabricating stacks of IC chips (20) into modules providing high density electronics. A relatively large number of layers (26) are stacked, and then integrated by curing adhesive (44) applied between adjacent layers (26). A large stack (20) is formed, various processing steps are performed on the access plane face (24) of the large stack (20), and then the large stack (20) is segmented to form a plurality of smaller, or short, stacks (22). Means (134) are provided for causing separation of the larger stack (20) into smaller stacks (22), without disturbing the adhesive (44) which binds the layers (26) within each small stack (22).
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