发明公开
- 专利标题： Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate
- 专利标题（中）： 焊料合金以及用于安装电子部件设置有焊料合金衬底：具有电子部件配置基板
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申请号： EP97116635.0申请日： 1997-09-24
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公开(公告)号： EP0875331A3公开(公告)日： 1999-04-21
- 发明人: Tadauchi, Masahiro , Teshima, Kouichi , Komatsu, Izuru , Nakamura, Shinichi , Furuya, Tomiaki , Hatanaka, Tatsuya , Hayashi, Masaru , Suzuki, Isao , Higashinakagawa, Emiko , Arai, Shinji , Yabuki, Motonaka
- 申请人： KABUSHIKI KAISHA TOSHIBA
- 申请人地址： 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210 JP
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210 JP
- 代理机构： Marsh, Roy David
- 优先权： JP108487/97 19970425
- 主分类号： B23K35/26
- IPC分类号： B23K35/26 ; H05K3/34 ; H01L23/495
摘要：
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12 % by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
公开/授权文献
- EP0875331B1 Method of bonding an electronic part to a substrate. 公开/授权日：2001-11-21
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