摘要:
A method for manufacturing an information memory disk comprises a process for preparing a die having an annular first rugged portion corresponding to tracks, and an annular second rugged portion corresponding to a positioning mark and concentrically located against the tracks, a process for manufacturing by the use of the die a blank having an annular rugged tracks (14) corresponding to the first rugged portion and an annular rugged positioning mark (16) corresponding to the second rugged portion, a process for detecting the position of the center of the blank on the basis of the positioning mark, a process for boring a hole (12) centering around the center of the positioning mark (16) through the blank, and a process for forming a light reflecting layer (15) on the annular rugged track.
摘要:
Barium-ferrite series powders are prepared from an alkaline aqueous solution containing a prescribed ratio of ions of the metals equal to those contained in the powder. In the first stage, the alkaline aqueous solution is heated at a constant volume at 150 to 300°C to precipitate a precursor of the barium-ferrite series powder. Then, the precursor is baked at 700 to 1,000°C to crystallize the precursor.
摘要:
An inkjet head comprises a pressure chamber; a nozzle plate including a first surface at the side of the pressure chamber, a second surface opposite to the first surface, a first nozzle formed into a frustum which penetrates the first surface and the second surface and the diameter of which decreases as it goes closer to the second surface, and a second nozzle formed into a frustum which is the same as the frustum of the first nozzle; and a driving element configured adjacent to the pressure chamber to eject droplets from the first nozzle and the second nozzle simultaneously; wherein the part of the first nozzle on the first surface is integrally connected to the part of the second nozzle on the first surface, and the part of the first nozzle on the second surface is separated from the part of the second nozzle on the second surface.
摘要:
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12 % by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
摘要:
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12 % by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.