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公开(公告)号：EP0875331B1
公开(公告)日：2001-11-21
申请号：EP97116635.0
申请日：1997-09-24
发明人： Tadauchi, Masahiro , Teshima, Kouichi , Komatsu, Izuru , Nakamura, Shinichi , Furuya, Tomiaki , Hatanaka, Tatsuya , Hayashi, Masaru , Suzuki, Isao , Higashinakagawa, Emiko , Arai, Shinji , Yabuki, Motonaka
IPC分类号： B23K35/26 , H05K3/34 , H01L23/495
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
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2.发明公开Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate 失效焊料合金以及用于安装电子部件设置有焊料合金衬底：具有电子部件配置基板
公开(公告)号：EP0875331A3
公开(公告)日：1999-04-21
申请号：EP97116635.0
申请日：1997-09-24
发明人： Tadauchi, Masahiro , Teshima, Kouichi , Komatsu, Izuru , Nakamura, Shinichi , Furuya, Tomiaki , Hatanaka, Tatsuya , Hayashi, Masaru , Suzuki, Isao , Higashinakagawa, Emiko , Arai, Shinji , Yabuki, Motonaka
IPC分类号： B23K35/26 , H05K3/34 , H01L23/495
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
摘要： Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12 % by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
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3.发明公开Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate 失效焊料合金以及用于安装电子部件设置有焊料合金衬底：具有电子部件配置基板
公开(公告)号：EP0875331A2
公开(公告)日：1998-11-04
申请号：EP97116635.0
申请日：1997-09-24
发明人： Tadauchi, Masahiro , Teshima, Kouichi , Komatsu, Izuru , Nakamura, Shinichi , Furuya, Tomiaki , Hatanaka, Tatsuya , Hayashi, Masaru , Suzuki, Isao , Higashinakagawa, Emiko , Arai, Shinji , Yabuki, Motonaka
IPC分类号： B23K35/26 , H05K3/34 , H01L23/495
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
摘要： Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12 % by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
摘要翻译： 公开了在使用的焊料合金用于接合电气或电子部件，包含：3〜12％（重量）的ZIN组分; 和锡组分。 焊料合金中的氧含量减少到100ppm或更少。 使用焊料合金，接合部分被形成在所述基板和电子部件被安装在其上，以获得一个基片，用于安装电子部件并在其上的电子部件被安装在基底上。 作出上述焊料合金的接合部，能够防止迁移。
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