发明公开
- 专利标题： Semiconductor chip assemblies, methods of making same and components for same
- 专利标题（中）： 半导体芯片阵列，生产方法和组件相同的
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申请号： EP01200301.8申请日： 1991-09-24
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公开(公告)号： EP1111672A2公开(公告)日： 2001-06-27
- 发明人: Khandros, Igor Y. , Distefano, Thomas H.
- 申请人： TESSERA, INC.
- 申请人地址： 103 Fairview Park Drive Elmsford, NY 10523 US
- 专利权人： TESSERA, INC.
- 当前专利权人： TESSERA, INC.
- 当前专利权人地址： 103 Fairview Park Drive Elmsford, NY 10523 US
- 代理机构： Beresford, Keith Denis Lewis
- 优先权： US586758 19900924; US673020 19910321
- 主分类号： H01L21/822
- IPC分类号： H01L21/822 ; H01L23/498
摘要：
Semiconductor chip assemblies incorporating flexible, sheetlike elements (42) having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals (48) on the sheetlike element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer (42) interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with test probe assembly so as to permit reliable engagement despite tolerances.
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